The cost of photonic components is dominated by assembly and packaging processes. This is a drag on adoption at a time when rapid global scaling of connectivity is required. Part one of the webinar covers the presentation of TEGEMA's new "Modular Machine Platform Enabling A Breakthrough In Photonics Assembly Speed."
Part two of the webinar puts us "Inside the solution: Intelligent Micro-Robotics for High Throughput Photonics Manufacturing Automation." It explains why the precise alignment of individual elements of photonic integrated circuits is so important for costs and yield. Learn about the technology and its utilization inside TEGEMA's modular-assembly platform.